TIP R-5010 Replacement of the Existing PSA Hotmelt Glue Module

Machine Model for Improvement

All BW Bielomatik RFID converting machines from T165/21 onwards.

Description of Improvement

This upgrade is part of the Technical Improvement Program (TIP), and replaces the existing hotmelt application

module with an advanced system.

The delivery scope is a module plate, a hotmelt tank for one nozzle, one specialized glue nozzle and specialized fixing parts. A special software application will provide an optimized coatweight control. Significantly better gluing uniformity compared with the existing system will be achieved, even during acceleration and deceleration.

This is achieved by a different controls architecture, including an additional high-precision glue pump close to the tip of the nozzle.

Benefits

  • High-precision glue application due to a special application pump in the gluing head
  • Optimized gluing characteristics during acceleration and deceleration
  • Extension to PUR / POR gluing possible

Download a brochure

Technical Service

The BW Papersystems Service Department is a highly dedicated team of people committed to giving the best customer support in the industry. Trained technicians are available for emergency service, machine updates and maintenance.

Technicians are available throughout the world for fast response and quality service. Learn more about how our service technicians can help you.

Click here for Technical Service

Service Technician
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